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Description High fidelity headphone amplifier
Product QR code
Brand: TI
Packaging HSOP-20
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
20.73  yuan 20.73yuan
5+:
$ 24.2576
50+:
$ 23.2210
200+:
$ 22.6404
500+:
$ 22.4953
1000+:
$ 22.3502
2500+:
$ 22.1843
5000+:
$ 22.0806
7500+:
$ 21.9770
Quantity
5+
50+
200+
500+
1000+
Price
$24.2576
$23.2210
$22.6404
$22.4953
$22.3502
Price $ 24.2576 $ 23.2210 $ 22.6404 $ 22.4953 $ 22.3502
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(9999) Minimum order quantity(5)
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Technical parameters/output current: 700 mA

Technical parameters/power supply current: 26 mA

Technical parameters/dissipated power: 2800 mW

Technical parameters/common mode rejection ratio: 100 dB

Technical parameters/output power: 1.5 W

Technical parameters/input compensation voltage: 5 mV

Technical parameters/output current (Max): 1400 mA

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Technical parameters/dissipated power (Max): 2800 mW

Technical parameters/Common Mode Rejection Ratio (Min): 100 dB

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 20

Encapsulation parameters/Encapsulation: HSOP-20

External dimensions/length: 12.82 mm

External dimensions/width: 7.52 mm

External dimensions/height: 2.55 mm

External dimensions/packaging: HSOP-20

Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Customs information/ECCN code: EAR99

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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