Chip AI consultant
Technical parameters/power supply current: 3.5 mA
Technical parameters/number of channels: 1
Technical parameters/number of pins: 9
Technical parameters/dissipated power: 1190 mW
Technical parameters/common mode rejection ratio: 75 dB
Technical parameters/output power: 3 W
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 1190 mW
Technical parameters/Common Mode Rejection Ratio (Min): 75 dB
Technical parameters/power supply voltage: 2.5V ~ 5.5V
Technical parameters/power supply voltage (Max): 5.5 V
Technical parameters/power supply voltage (Min): 2.5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 9
Encapsulation parameters/Encapsulation: DSBGA-9
External dimensions/length: 1.8 mm
External dimensions/width: 1.8 mm
External dimensions/height: 0.35 mm
External dimensions/packaging: DSBGA-9
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standard/REACH SVHC version: 2015/06/15
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPA2018D1YZFR
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TPA6136A2YFFR
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TI | 功能相似 | DSBGA-16 |
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