Technical parameters/number of circuits: 1
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HTSSOP
External dimensions/packaging: HTSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 类似代替 |
采用直流音量控制和MUX控制的立体声2W音频功率放大器 STEREO 2-W AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL AND MUX CONTROL
|
|||
TPA0232PWP
|
TI | 类似代替 | HTSSOP-24 |
采用直流音量控制和MUX控制的立体声2W音频功率放大器 STEREO 2-W AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL AND MUX CONTROL
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review