Chip AI consultant
Technical parameters/output current: 250 mA
Technical parameters/power supply current: 3 mA
Technical parameters/number of circuits: 1
Technical parameters/dissipated power: 725 mW
Technical parameters/Static current: 1.50 mA
Technical parameters/output power: 70 mW
Technical parameters/input compensation voltage: 5 mV
Technical parameters/output current (Max): 250 mA
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 725 mW
Technical parameters/power supply voltage: 2.5V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 4.9 mm
External dimensions/width: 3.91 mm
External dimensions/height: 1.58 mm
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPA112DR
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TI | 类似代替 | SOIC-8 |
150mW 立体声、模拟输入 AB 类音频放大器 8-SOIC
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Rochester | 类似代替 |
Texas Instruments Texas Instruments 高度集成 AB 类音频功率放大器 IC 系列带双输出或多输出，适用于立体声和多通道应用。 低功率设备的放大器系列适用于将耳机变为高功率类型，具有高达 60W 或更大输出。 ### 音频放大器，Texas Instruments
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TPA302D
|
TI | 类似代替 | SOIC-8 |
Texas Instruments Texas Instruments 高度集成 AB 类音频功率放大器 IC 系列带双输出或多输出，适用于立体声和多通道应用。 低功率设备的放大器系列适用于将耳机变为高功率类型，具有高达 60W 或更大输出。 ### 音频放大器，Texas Instruments
|
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TPA302DR
|
TI | 类似代替 | SOIC-8 |
300 - mW的立体声音频功率放大器 300-mW STEREO AUDIO POWER AMPLIFIER
|
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