Technical parameters/number of circuits: 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: HTSSOP
External dimensions/packaging: HTSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Rochester | 类似代替 |
采用直流音量控制2 -W立体声音频功率放大器 2-W STEREO AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL
|
|||
TPA0132PWP
|
TI | 类似代替 | HTSSOP-24 |
采用直流音量控制2 -W立体声音频功率放大器 2-W STEREO AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL
|
||
|
|
Rochester | 类似代替 |
Class-AB级放大器
|
|||
TPA0212PWP
|
TI | 类似代替 | HTSSOP-24 |
Class-AB级放大器
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review