Technical parameters/Holding current (Max): 150mA (Min)
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TISP6NTP2CD
|
Bourns J.W. Miller | 完全替代 | SOIC-8 |
高压振铃SLIC保护 High Voltage Ringing SLIC Protector
|
||
TISP6NTP2CDR-S
|
Bourns J.W. Miller | 完全替代 | SOIC-8 |
BOURNS TISP6NTP2CDR-S TVS晶闸管, 8 引脚, SOIC, SLIC保护器, 15 V, 2 电路
|
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