Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: TO-218
External dimensions/length: 20.6 mm
External dimensions/width: 20.6 mm
External dimensions/packaging: TO-218
External dimensions/thickness: 0.178 mm
Physical parameters/color: Gray
Physical parameters/materials: Silicone
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Thermal Management
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
K177-NA-403+BQ35
|
Multicomp | 功能相似 |
MULTICOMP K177-NA-403+BQ35 绝缘套件
|
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