Technical parameters/RAM size: 128K x 8
Encapsulation parameters/Encapsulation: TFSOP-56
External dimensions/packaging: TFSOP-56
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TMS5700914APGEQQ1
|
TI | 功能相似 | LQFP-144 |
16/32 位 RISC 闪存 MCU,Arm Cortex-R4F,通过 Q-100 车规认证 144-LQFP -40 to 125
|
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