Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/height: 1.45 mm
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: -40℃ ~ 125℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TMS320C6747DZKBT3
|
TI | 类似代替 | BGA-256 |
TMS320C6745 , TMS320C6747固定/浮点数字信号处理器 TMS320C6745,TMS320C6747 Fixed/Floating-Point Digital Signal Processor
|
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