Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 697
Encapsulation parameters/Encapsulation: FCBGA
External dimensions/packaging: FCBGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TMS320C6455DCTZA8
|
TI | 功能相似 | BFBGA-697 |
数字信号处理器(DSP/DSC) TMS320C6455DCTZA8 FCBGA-697
|
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