Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: TQFP-144
External dimensions/packaging: TQFP-144
Physical parameters/operating temperature: -40℃ ~ 105℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TMSDC6726BRFPA225
|
TI | 功能相似 | TQFP-144 |
TEXAS INSTRUMENTS TMSDC6726BRFPA225 芯片, DSP, C6000, 浮点型, TQFP144
|
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