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Model TLV7211IDRG4
Description CMOS Comparisons with Rail to Rail Input and Push Pull Output for Rail to Rail Input and PUSH-PULL OUTPUT
Product QR code
Brand: TI
Packaging SOIC
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9999) Minimum order quantity(1)
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Technical parameters/power supply voltage (DC): 2.70V (min)

Technical parameters/power supply current: 7.00 µA

Technical parameters/number of circuits: 1

Technical parameters/number of channels: 1

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 8

Encapsulation parameters/Encapsulation: SOIC

External dimensions/packaging: SOIC

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
TLV7211IDR TLV7211IDR TI 类似代替 SOIC-8
具有轨至轨输入CMOS比较和推挽输出 CMOS COMPARATORS WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT

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