Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MSOP
External dimensions/packaging: MSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2545CDGK
|
TI | 功能相似 | VSSOP-8 |
2.7 V至5.5 V ,低功耗, 12位, 200 KSPS ,串行模拟数字转换器具有自功率谱DOWN 2.7 V TO 5.5 V, LOW POWER, 12-BIT, 200 KSPS, SERIAL ANALOG-TO-DIGITAL CONVERTERS WITH AUTOPOWER DOWN
|
||
TLV2545IDGK
|
TI | 功能相似 | VSSOP-8 |
2.7 V至5.5 V ,低功耗, 12位,二百分之一百四十○ KSPS ,串行模拟数字转换器具有自功率谱DOWN 2.7-V TO 5.5-V, LOW-POWER, 12-BIT, 140/200 KSPS, SERIAL ANALOG-TO-DIGITAL CONVERTERS WITH AUTOPOWER DOWN
|
||
TLV2545IDGKR
|
TI | 功能相似 | VSSOP-8 |
12Bit, 200KSPS ADC, Ser. Out, TMS320 Compatible (up to 10MHz), Single Ch. Pseudo-Differential 8-VSSOP -40℃ to 85℃
|
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