Chip AI consultant
Technical parameters/power supply current: 2.40 mA
Technical parameters/number of circuits: 1
Technical parameters/digits: 12
Technical parameters/dissipated power: 1110 mW
Technical parameters/sampling rate: 200 ksps
Technical parameters/power consumption: 3.3 mW
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/number of inputs: 4
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 1110 mW
Technical parameters/number of input channels: 4
Technical parameters/input voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/length: 9.9 mm
External dimensions/width: 3.91 mm
External dimensions/height: 1.58 mm
External dimensions/packaging: SOIC-16
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2544QD
|
TI | 完全替代 | SOIC-16 |
3 V至5.5 V ，12位， 200 KSPS ，4 / 8通道，低功耗串行模拟数字转换器具有自功率谱-DOWN 3-V TO 5.5-V, 12-BIT, 200-KSPS, 4-/8-CHANNEL, LOW-POWER SERIAL ANALOG-TO-DIGITAL CONVERTERS WITH AUTOPOWER-DOWN
|
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