Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2702ID
|
TI | 功能相似 | SOIC-8 |
OP+比较器
|
||
TLV2702IDG4
|
TI | 功能相似 | SOIC-8 |
运算放大器 (1) + 推挽比较器 (1) 集成器件 IC 8-SOIC -40 to 125
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review