Chip AI consultant
Technical parameters/power supply current: 750 µA
Technical parameters/number of circuits: 1
Technical parameters/number of channels: 1
Technical parameters/dissipated power: 0.71 W
Technical parameters/common mode rejection ratio: 55 dB
Technical parameters/Input compensation drift: 2.00 µV/K
Technical parameters/bandwidth: 2.40 MHz
Technical parameters/conversion rate: 2.40 V/μs
Technical parameters/gain bandwidth product: 3 MHz
Technical parameters/input compensation voltage: 2 mV
Technical parameters/input bias current: 1 pA
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/gain bandwidth: 3 MHz
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 4.9 mm
External dimensions/width: 3.91 mm
External dimensions/height: 1.58 mm
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2370IDRG4
|
TI | 类似代替 | SOIC-8 |
家庭550 -UA /的CH 3 MHz的轨到轨输入/输出运算放大器，带有关断 FAMILY OF 550-uA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT OPERATIONAL AMPLIFIERS WITH SHUTDOWN
|
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