Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP-20
External dimensions/packaging: TSSOP-20
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2217-33PWR
|
TI | 功能相似 | TSSOP-20 |
低压差固定电压稳压 LOW DROPOUT FIXED VOLTAGE REGULATORS
|
||
TLV2217-33PWRG4
|
TI | 功能相似 | TSSOP-20 |
低压差固定电压REGULATOES LOW-DROPOUT FIXED-VOLTAGE REGULATOES
|
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