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Model TLP2531
Description TOSHIBA TLP2531 Optocoupler, transistor output, 2-channel, DIP, 8-pin, 25 mA, 2.5 kV, 19%
Product QR code
Brand: Toshiba
Packaging DIP-8
Delivery time
Packaging method Each
Standard packaging quantity 1
6.25  yuan 6.25yuan
10+:
$ 7.5000
100+:
$ 7.1250
500+:
$ 6.8750
1000+:
$ 6.8625
2000+:
$ 6.8125
5000+:
$ 6.7500
7500+:
$ 6.7000
10000+:
$ 6.6750
Quantity
10+
100+
500+
1000+
2000+
Price
$7.5000
$7.1250
$6.8750
$6.8625
$6.8125
Price $ 7.5000 $ 7.1250 $ 6.8750 $ 6.8625 $ 6.8125
Start batch production 10+ 100+ 500+ 1000+ 2000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9999) Minimum order quantity(10)
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Technical parameters/output voltage: 15.0 V

Technical parameters/output current: 8 mA

Technical parameters/number of channels: 2

Technical parameters/number of pins: 8

Technical parameters/forward voltage: 1.65 V

Technical parameters/input current: 16.0 mA

Technical parameters/dissipated power: 45 mW

Technical parameters/isolation voltage: 2.5 kV

Technical parameters/output voltage (Max): 15 V

Technical parameters/forward voltage (Max): 1.7 V

Technical parameters/forward current (Max): 25 mA

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -25 ℃

Technical parameters/dissipated power (Max): 45 mW

Encapsulation parameters/installation method: Through Hole

Package parameters/number of pins: 8

Encapsulation parameters/Encapsulation: DIP-8

External dimensions/length: 9.66 mm

External dimensions/width: 6.4 mm

External dimensions/height: 3.65 mm

External dimensions/packaging: DIP-8

Other/Product Lifecycle: Obsolete

Other/Packaging Methods: Each

Other/Manufacturing Applications: Power Management, Signal Processing, Measurement instrumentation, Power management, Communication interface, PLC, Signal processing

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standard/REACH SVHC version: 2015/06/15

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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