Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV5617AID
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TI | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS TLV5617AID 数模转换器, 双路, 10 bit, 93 kSPS, 串行, 2.7V 至 5.5V, SOIC, 8 引脚
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