Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MSOP
External dimensions/packaging: MSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLC2551ID
|
TI | 功能相似 | SOIC-8 |
12 位,单通道 ( ### 模拟至数字转换器 - Texas Instruments
|
||
TLV1572IDR
|
TI | 功能相似 | SOIC-8 |
串行ANALOG -TO -DIGITAL具有自动POWERDOWN转换器 SERIAL ANALOG-TO-DIGITAL CONVERTER WITH AUTO-POWERDOWN
|
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