Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TL431CDBVR
|
TI | 功能相似 | SOT-23-5 |
TEXAS INSTRUMENTS TL431CDBVR 芯片, 并联电压基准
|
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TL431CDBVT
|
TI | 功能相似 | SOT-23-5 |
TL 系列 ### 电压参考,Texas Instruments 精密固定和可调电压参考 IC 利用串联、并联或串联/并联拓扑,并提供通孔和表面安装封装。 电压参考的初始准确度为 ±0.02 至 ±2%。
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TL431CPSR
|
TI | 功能相似 | SOP-8 |
TL 系列
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