Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Cut Tape (CT), Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PCA82C250T/YM,118
|
NXP | 功能相似 | SOIC-8 |
NXP PCA82C250T/YM,118 总线, CAN, ISO 11898, 4.5 V, 5.5 V, SOIC 新
|
||
PCA82C250TD
|
NXP | 类似代替 | SOIC |
5V高速CAN总线收发器
|
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