Chip AI consultant
Encapsulation parameters/Encapsulation: | PG-FBGA-516-1 |
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Dimensions/Packaging: | PG-FBGA-516-1 |
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Other/Program Storage Capacity: | 10MB(10M x 8) |
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Other/Program Memory Types: | flash memory |
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Other/Operating Temperature: | -40°C ~ 150°C(TA) |
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Other/oscillator types: | internal |
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Other/Packaging/Shell: | 516-FBGA |
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Other/Core processors: | TriCore™ |
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Other/RAM sizes: | 1.53K x 8 |
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Other/Speed: | 300MHz |
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Other/kernel specifications: | 32-bit |
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Other/Connection Capability: | ASC,CANbus,Ethernet, FlexRay,HSSL,I²C,LINbus,MSC,PSI,QSPI,SENT |
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Other/Peripheral Devices: | DMA,I²S,PWM,WDT |
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Other/Voltage Power Supply (Vcc/Vdd): | 3.3V,5V |
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Compliant with standards/RoHS standards: | Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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