Chip AI consultant
Encapsulation parameters/Encapsulation: | - |
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Dimensions/Packaging: | - |
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Other/Width (Nom.)/mm: | 6.5 |
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Other/Working Temperature Min: | -55℃ |
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Other/Length (Nom.)/mm: | 7 |
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Other/Features: | Magnetic Shield |
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Other/Inductive Measurement Frequency: | 100000Hz |
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Other/Application: | Automotive Grade |
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Other/Packaging/Shell: | 7.0mm x 6.5mm |
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Other/Length: | 7.00mm±0.40mm |
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Other/Length (Max.)/mm: | 7.4 |
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Other/Width (Min.)/mm: | 6.1 |
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Other/AEC-Q200: | Yes |
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Other/Series: | SPM6545VT*D |
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Other/Weight (Nom.)/g: | 1 |
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Other/Temperature Rise Value of Rated Current/° C: | 40 |
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Other/Packing: | Blister (Plastic)Taping [330mm Reel] |
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Other/Rated Current: | 23.9A |
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Other/Thickness | Height (Max.)/mm: | 4.5 |
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Other/Deviation: | ±20% |
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Other/Inductance: | 1uH |
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Other/L Change Ratio of Rated Current/%: | 30 |
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Other/Width: | 6.50mm±0.40mm |
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Other/Storage Temperature Range (Max.)/° C: | 155 |
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Other/Width (Max.)/mm: | 6.9 |
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Other/Length (Min.)/mm: | 6.6 |
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Other/DC resistors (DCR): | 5.6m Ohms |
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Other/Stacking Methods: | Reflow |
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Other/Thickness: | 4.50mm Max. |
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Other/Rated current - L Change: | 23.9A |
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Other/Rated Current - Temperature Rise: | 13.3A |
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Other/Storage Temperature Range (Min.)/° C: | -55 |
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Other/Working Temperature Max: | 155℃ |
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Other/DC r Alternative material
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