Technical parameters/peak pulse power: | 300 W |
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Technical parameters/minimum reverse breakdown voltage: | 13.3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Manufacturing Applications: | General |
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Compliant with standards/RoHS standards: |
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Compliant with standards/lead standards: | lead-free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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