Chip AI consultant
Package parameters/number of pins: | 100 |
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Encapsulation parameters/Encapsulation: | BGA |
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Dimensions/Packaging: | BGA |
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Other/EU RoHS: | Compliant |
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Other/Package Length: | 18 |
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Other/Package Width: | 14 |
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Other/Counting: | Surface Mount |
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Other/Lead Shapes: | Ball |
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Other/PCB changed: | 100 |
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Other/Package Height: | 1.4 |
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Other/Cell Type: | MLC NAND |
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Other/Chip Density (bits): | 32G |
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Other/Supplier Temperature Grade: | Industrial |
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Other/Standard Package Name: | BGA |
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Other/Pin Count: | 100 |
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Other/Supplier Packages: | BGA |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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