Encapsulation parameters/installation method: | Through Hole |
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Other/Type: | SIP |
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Other/Pin or Pin Count (Grid): | 32（1 x 32） |
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Other/spacing - matching: | 0.100"（2.54mm） |
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Other/Contact Surface Treatment - Matching: | gold |
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Other/Contact Surface Treatment Thickness - Matching: | 30µin（0.76µm） |
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Other/Contact Materials - Matching: | Copper beryllium |
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Other/Installation Types: | through hole |
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Other/Features: | Closed frame |
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Other/End Connections: | welding |
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Other/Spacing - Column: | 0.100"（2.54mm） |
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Other/Contact Surface Treatment - Column: | tin |
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Other/Contact Surface Treatment Thickness - Column: | 200µin（5.08µm） |
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Other/Contact Materials - Column: | brass |
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Other/Shell Materials: | Polyethylene terephthalate dimethyl cyclohexyl ester (PCT), polyester, glass fiber reinforced type |
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Other/Operating Temperature: | - |
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Other/Terminal Column Length: | 0.095"（2.41mm） |
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Flammability level of other/materials: | UL94 V-0 |
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Other/Rated Current: | - |
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Other/Contact Resistance: | - |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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