Chip AI consultant
Encapsulation parameters/Encapsulation: | D2PAK |
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Dimensions/Packaging: | D2PAK |
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Other/Configuration: | P-CH |
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Other/V (DS): | -100 V |
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Other/I (D) at Tc=25 ° C: | -6,8 A |
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Other/RDS (on) at 10V: | 600 mOhm |
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Other/Package: | D2PAK |
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Other/Q (g): | 18 nC |
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Other/P (tot): | 60 W |
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Other/R (thJC): | 2.5 K/W |
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Other/Logic levels: | NO |
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Other/Automotive: | NO |
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Other/Counting: | SMD |
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Other/Headfree Defin.: | RoHS-conform |
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Other/Packaging: | TUBE |
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Other/Customs Tariff No.: | 85412900000 |
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Other/Countries: | Japan |
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Other/Supplier Leadtime: | 12 weeks |
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Compliant with standards/RoHS standards: | RoHS-conform |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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