Technical parameters/rated power: | 3.1 W |
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Technical parameters/number of pins: | 8 |
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Technical parameters/drain source resistance: | 0.018 Ω |
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Technical parameters/polarity: | Dual N |
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Technical parameters/dissipated power: | 2 W |
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Technical parameters/threshold voltage: | 1.5 V |
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Technical parameters/drain source voltage (Vds): | 20 V |
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Technical parameters/Continuous drain current (Ids): | 8A |
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Technical parameters/Input capacitance (Ciss): | 1200pF @10V(Vds) |
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Technical parameters/rated power (Max): | 3.1 W |
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Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/dissipated power (Max): | 2000 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -55℃ ~ 150℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Minimum Packaging: | 2500 |
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Other/Manufacturing Applications: | Computers and computer peripherals, power management, industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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