Chip AI consultant
Encapsulation parameters/Encapsulation: | DFN |
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Dimensions/Packaging: | DFN |
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Other/Interface: | I2C |
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Other/Package: | DFN |
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Other/Humidity (min): | 0 %RH |
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Other/Humidity (max): | 100 %RH |
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Other/Vcc (max): | 5.5 V |
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Other/Top (max): | 123.8 °C |
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Other/Accuracy (min): | -3 %RH |
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Other/Accuracy (max): | 3 %RH |
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Other/Automotive: | NO |
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Other/T-Sensors: | Yes |
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Other/Vcc (min): | 3.3 V |
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Other/Top (min): | -40 °C |
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Other/Headfree Defin.: | RoHS-conform |
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Other/Packaging: | BOX |
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Other/Supplier Parts: | 1-100738-02 |
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Other/Customs Tariff No.: | 85437090990 |
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Other/Countries: | Switzerland |
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Other/Supplier Leadtime: | 7 weeks |
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Compliant with standards/RoHS standards: | RoHS-conform |
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