Technical parameters/capacitance: | 333 pF |
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Technical parameters/tolerances: | ±20 % |
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Technical parameters/breakdown voltage: | 100 V |
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Encapsulation parameters/Encapsulation: | Nonstandard Chip |
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Dimensions/Length: | 40 m |
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Dimensions/Packaging: | Nonstandard Chip |
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Physical parameters/operating temperature: | -65℃ ~ 200℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Other/Manufacturing Applications: | high temperature |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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