Technical parameters/digits: | 16 |
|
Technical parameters/access time (Max): | 110 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Package parameters/number of pins: | 64 |
|
Encapsulation parameters/Encapsulation: | BGA |
|
Dimensions/Packaging: | BGA |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL01GS11DHI010
|
Spansion | 完全替代 | FBGA-64 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL01GS11DHI010
|
Cypress Semiconductor | 完全替代 | FBGA-64 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL01GS11DHIV10
|
Cypress Semiconductor | 完全替代 | FBGA-64 |
闪存, 或非, 并行NOR, 1 Gbit, 64M x 16位, 并行, FBGA, 64 引脚
|
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