Encapsulation parameters/Encapsulation: | Die |
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Dimensions/Packaging: | Die |
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Other/Series: | GL-N |
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Other/Packaging: | Bulk |
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Other/Package Case: | Die |
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Other operating temperatures: | -40°C ~ 85°C (TA) |
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Other/Interface: | Parallel |
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Other/Voltage Supply: | 1.65 V ~ 3.6 V |
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Other Supplier Device Packages: | Wafer |
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Other/Memory Size: | 32M (4M x 8, 2M x 16) |
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Other/Memory Type: | FLASH - NOR |
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Other/Speed: | 110ns |
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Other/Format Memory: | FLASH |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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