Technical parameters/number of pins: | 16 |
|
Technical parameters/clock frequency: | 133 MHz |
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Technical parameters/access time (Max): | 8 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 2.7V ~ 3.6V |
|
Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 2.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
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Customs information/ECCN code: | 3A991.b.1.a |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL256LAGMFI001
|
Cypress Semiconductor | 完全替代 | SOIC-16 |
闪存, 浮动门架构, 串行NOR, 256 Mbit, 32M x 8位, SPI, SOIC, 16 引脚
|
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