Technical parameters/Contact electroplating: | Tin |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Packaging parameters/pin spacing: | 3.25 mm |
|
Dimensions/Length: | 3.25 mm |
|
Dimensions/Width: | 1.65 mm |
|
Dimensions/Height: | 2.00 mm |
|
Dimensions/Pin Spacing: | 3.25 mm |
|
Physical parameters/color: | Natural |
|
Physical parameters/contact material: | Copper Alloy |
|
Physical parameters/materials: | Copper Alloy |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Other/Manufacturing Applications: | Testing and Measurement |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S1751-46R
|
Harwin | 完全替代 | - |
HARWIN S1751-46R. 连接器, 电路板测试点
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review