Technical parameters/Contact electroplating: | Tin Lead |
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Technical parameters/rated current: | 3 A |
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Technical parameters/number of rows: | 2 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/rated voltage: | 250 V |
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Encapsulation parameters/installation method: | Through Hole |
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Packaging parameters/pin spacing: | 2.50 mm |
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Dimensions/Pin Spacing: | 2.50 mm |
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Physical parameters/shell color: | Natural |
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Physical parameters/color: | Natural |
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Physical parameters/contact material: | Copper Alloy |
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Physical parameters/operating temperature: | -25℃ ~ 85℃ |
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Other/Product Lifecycle: | Obsolete |
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Other/Packaging Methods: | Bulk |
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Other/Manufacturing Applications: | - |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S08B-XADSS-N(LF)(SN)
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JST | 功能相似 | Through Hole,P=2.5mm |
JST (JAPAN SOLDERLESS TERMINALS) S08B-XADSS-N(LF)(SN) 线至板连接器, XAD系列, 8 触点, 针座, 2.5 mm, 通孔安装, 2 排
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