Chip AI consultant
Package parameters/number of pins: | 35 |
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Encapsulation parameters/Encapsulation: | SMD |
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Dimensions/Packaging: | SMD |
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Other/Lead Finish: | Gold over Nickel |
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Other/Counting: | Surface Mount |
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Other/Operating Supply Voltage: | 3.3000 V |
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Other/MSL Levels: | 1 |
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Other/Maximum Standby Current: | 0.025 A |
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Other/Power Class: | Class II |
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Other/Max Processing Temps: | 250 °C |
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Other/Supplier Packages: | SMD |
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Other/Pin Count: | 35 |
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Other/Product Dimensions: | 13.4 x 25.8 x 2 mm |
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Other/Maximum Data Rate: | 3 Mbps |
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Other/ECCN: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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