Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SOP |
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Dimensions/Packaging: | SOP |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
REF194ES
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ADI | 功能相似 | SOIC-8 |
精密微功耗,低压差,电压基准 Precision Micropower, Low Dropout, Voltage References
|
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REF194ESZ
|
ADI | 功能相似 | SOIC-8 |
3.0V 至 4.5V,Analog Devices ### 电压参考,Analog Devices 精密固定和可调电压参考 IC 利用串联、并联或串联/并联拓扑,并提供通孔和表面安装封装。 电压参考的初始准确度为 ±0.02 至 ±2%。
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