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Model R7S910017CBG#AC0
Description RZ/T1 32 The Renesas RZ/T1 device is a 32-bit microprocessor in the RZ series of embedded processors. Equipped with a 600 MHz ARM Cortex-R4 core, capable of real-time processing. The high speed and response rate of RZ/T1 microprocessor are suitable for industrial applications. ###Microprocessor functionality 32-bit ARM Cortex R4F core maximum operation 600 MHz maximum operation 996 DMIPS Harvard architecture with 8-stage pipeline floating-point unit (FPU) ARM CoreSight architecture direct memory access controller (DMAC) event link controller (ELC) flexible clock options independent monitoring timer (IWDT) external address space multifunctional pin controller (MPC) JTAG and SWD debugging interface memory protection device (MPU) support # # # low-power function 3 low-power modes - standby, sleep, and module stop # # peripheral function 12 bit analog-to-digital converter (ADC) -24 channel extended function timer -33 channel temperature sensor # # # communication function EtherMAC -1 port EtherCAT slave controller USB 2.0 host interface -1 Channel CAN interface -2-channel SCIFA with FIFO-5 Channel RSPIa interface -4-channel I ² C interface -2-channel SPIBSC interface -1-channel Serial Peripheral Interface (SPI) -4-channel Quad Serial Peripheral Interface (QSPI) -1-channel ∆∑ interface # # # RZ embedded microprocessor, Renesas Electronics RZ series microprocessor combines Renesas technology with ARM ® Integration of ecosystems. Microprocessors have been developed to provide high-performance and energy-saving solutions required for human-machine interfaces and cloud technology.
Product QR code
Brand: Renesas Electronics
Packaging FBGA
Delivery time
Packaging method Tray
Standard packaging quantity 1
86.07  yuan 86.07yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(2049) Minimum order quantity(1)
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Technical parameters/RAM size:

1568 kB

 

Technical parameters/Analog to Digital Conversion (ADC):

1

 

Technical parameters/operating temperature (Max):

125 ℃

 

Technical parameters/operating temperature (Min):

-40 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

320

 

Encapsulation parameters/Encapsulation:

FBGA

 

Dimensions/Length:

17.2 mm

 

Dimensions/Width:

1.85 mm

 

Dimensions/Height:

17.2 mm

 

Dimensions/Packaging:

FBGA

 

Other/Product Lifecycle:

Unknown

 

Other/Packaging Methods:

Tray

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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