Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | PB free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
R1EX24256BSAS0I#K0
|
Renesas Electronics | 功能相似 | SOIC-8 |
EEPROM Serial-2Wire 256Kbit 32K x 8 2.5V/3.3V/5V 8Pin SOP T/R
|
||
R1EX24256BTAS0I#S0
|
Renesas Electronics | 功能相似 | TSSOP-8 |
EEPROM Serial-2Wire 256Kbit 32K x 8 2.5V/3.3V/5V 8Pin TSSOP T/R
|
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