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Description QRF8 Series Slim Body Ground Plane Sockets These Board to Board QRF8 Series connectors have 0.25 μm Gold plated contacts with Tin plated Tails. This range of Board to Board QRF8 Series connectors are available: with and without Guide Posts, straight or right angle, 5 or 7 mm body heights. The design of these Board to Board QRF8 Series connector includes samtec"s Edge Rate contacts. QRF8-xxx-**05.0**-x-x-x-xx have a Body height of 5 mm QRF8-xxx-**07.0**-x-x-x-xx have a Body height of 7 mm QRF8-xxx-xx.x-x-x-x-**GP** have Guide Posts QRF8-xxx-xx-x-**RA-GP** have a horizontal orientation with Guide Posts ### note Mates with QRM8 Series Headers see stock number 767-7115 typical. Guide Post versions require Guide Post mating articles. ### 0.8mm Board to Board - Samtec Compatibility Table - Series Name | Matching Object BSE | BTE CLE | FTE QSE | QTE ERF8 | ERM8 QRF8 | QRM8 Rated Current | BSE, BTE, QTE, and QSE Series: 2A CLE and FTE Series: 0.75A --- Contact Material | BSE, BTE, QTE, QSE, and FTE Series: phosphor bronze CLE Series: beryllium copper contact electroplating | gold working temperature range | -65 ° C →+125 ° C
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Brand: Samtec
Packaging -
Delivery time
Packaging method Tray
Standard packaging quantity 1
67.82  yuan 67.82yuan
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(6792) Minimum order quantity(1)
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Technical parameters/number of contacts:

52

 

Technical parameters/polarity:

Female

 

Technical parameters/Contact electroplating:

Gold

 

Technical parameters/rated current:

2 A

 

Technical parameters/number of rows:

2

 

Technical parameters/number of pins:

52

 

Technical parameters/operating temperature (Max):

125 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Technical parameters/rated voltage:

215 VAC

 

Encapsulation parameters/installation method:

Surface Mount

 

Encapsulation parameters/Encapsulation:

-

 

Dimensions/Height:

6.26 mm

 

Dimensions/Packaging:

-

 

Physical parameters/shell color:

Black

 

Physical parameters/contact material:

Beryllium Copper

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Tray

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

lead-free

 

Compliant with the REACH SVHC standard:

No SVHC

 

Compliant with standard/REACH SVHC version:

2014/12/17

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
QRF8-026-05.0-L-D-A-K QRF8-026-05.0-L-D-A-K Samtec 完全替代 Solder
Conn High Speed Socket Strip SKT 52POS 0.8mm Solder ST SMD
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