Technical parameters/minimum current amplification factor (hFE): | 120 |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Technical parameters/dissipated power (Max): | 300 mW |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 6 |
|
Encapsulation parameters/Encapsulation: | UMT |
|
Dimensions/Length: | 2.2 mm |
|
Dimensions/Width: | 1.35 mm |
|
Dimensions/Height: | 1 mm |
|
Dimensions/Packaging: | UMT |
|
Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
FFB2227A
|
ON Semiconductor | 功能相似 | SC-70-6 |
FAIRCHILD SEMICONDUCTOR FFB2227A 双极晶体管阵列, NPN, PNP, 30 V, 300 mW, 500 mA, 100 hFE, SC-70
|
||
PUMZ2,115
|
Nexperia | 类似代替 | SC-70-6 |
NXP PUMZ2,115 双极晶体管阵列, NPN, PNP, 50 V, 180 mW, 150 mA, 250 hFE, SOT-363
|
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