Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PTH12050LAD
|
Artesyn Embedded Technologies | 完全替代 | DIP-6 |
非隔离式DC/DC转换器 10.8-13.2Vin 1.8V 6A 0.870" x0.495"x0.335
|
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