Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Artesyn Embedded Technologies | 完全替代 | DIP-10 |
15非隔离DDR / QDR存储器总线终端模块 15-A NON-ISOLATED DDR/QDR MEMORY BUS TERMINATION MODULES
|
||
PTH03010YAD
|
TI | 完全替代 | DIP-10 |
15非隔离DDR / QDR存储器总线终端模块 15-A NON-ISOLATED DDR/QDR MEMORY BUS TERMINATION MODULES
|
||
PTH03010YAD
|
Emerson Network Power | 完全替代 | 34.8 mm x 15.75 mm x 9 mm |
15非隔离DDR / QDR存储器总线终端模块 15-A NON-ISOLATED DDR/QDR MEMORY BUS TERMINATION MODULES
|
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