Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/power supply voltage: | 1.71V ~ 3.465V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
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Encapsulation parameters/Encapsulation: | BGA-256 |
|
Dimensions/Packaging: | BGA-256 |
|
Physical parameters/operating temperature: | 0℃ ~ 85℃ (TJ) |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFXP10C-3F256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256Pin FBGA Tray
|
||
LFXP10C-3FN256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256Pin FBGA Tray
|
||
LFXP10C-4F256C
|
Lattice Semiconductor | 完全替代 | FPBGA-256 |
FPGA LatticeXP Family 10000 Cells 360MHz 130nm Technology 1.8V/2.5V/3.3V 256Pin FBGA Tray
|
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