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Model PMEG2015EH
Description 1A Up to 1.5A, NXP Semiconductors' efficient ultra small and thin surface mount packaging has been optimized for low forward voltage drop, high junction temperature, and negligible power switching loss with low leakage current in diodes and rectifiers. NXP Semiconductors NXP offers a wide range of switching diodes in different packages and configurations.
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Brand: NXP
Packaging SOD-123F
Delivery time
Packaging method Each
Standard packaging quantity 1
1.13  yuan 1.13yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(4685) Minimum order quantity(1)
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Technical parameters/forward voltage:

660 mV

 

Technical parameters/forward current:

1.5 A

 

Technical parameters/Maximum forward surge current (Ifsm):

9 A

 

Technical parameters/forward voltage (Max):

660 mV

 

Technical parameters/forward current (Max):

1.5 A

 

Technical parameters/operating temperature (Max):

150 ℃

 

Technical parameters/operating temperature (Min):

-65 ℃

 

Technical parameters/working junction temperature (Max):

150 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

2

 

Encapsulation parameters/Encapsulation:

SOD-123F

 

Dimensions/Length:

1.7 mm

 

Dimensions/Width:

2.7 mm

 

Dimensions/Height:

1.2 mm

 

Dimensions/Packaging:

SOD-123F

 

Physical parameters/operating temperature:

-65℃ ~ 150℃

 

Other/Product Lifecycle:

Unknown

 

Other/Packaging Methods:

Each

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with the REACH SVHC standard:

No SVHC

 

Compliant with standard/REACH SVHC version:

2014/12/17

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
PMEG2015EH PMEG2015EH Nexperia 类似代替 SOD-123F
肖特基势垒二极管，1A 至 1.5A，Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
PDF
PMEG2015EH PMEG2015EH NXP 类似代替 SOD-123F
肖特基势垒二极管，1A 至 1.5A，Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
PDF

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