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Model PMEG6010CPA
Description 1A Up to 1.5A, NXP Semiconductors' efficient ultra small and thin surface mount packaging has been optimized for low forward voltage drop, high junction temperature, and negligible power switching loss with low leakage current in diodes and rectifiers. NXP Semiconductors NXP offers a wide range of switching diodes in different packages and configurations.
Product QR code
Brand: NXP
Packaging SOT-1061
Delivery time
Packaging method Cut Tape (CT)
Standard packaging quantity 1
0.84  yuan 0.84yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9394) Minimum order quantity(1)
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Technical parameters/number of pins:

3

 

Technical parameters/forward current:

1 A

 

Technical parameters/Maximum forward surge current (Ifsm):

9 A

 

Technical parameters/forward voltage (Max):

540 mV

 

Technical parameters/forward current (Max):

1 A

 

Technical parameters/operating temperature (Max):

150 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

3

 

Encapsulation parameters/Encapsulation:

SOT-1061

 

Dimensions/Length:

2.1 mm

 

Dimensions/Width:

2.1 mm

 

Dimensions/Height:

0.65 mm

 

Dimensions/Packaging:

SOT-1061

 

Other/Product Lifecycle:

Unknown

 

Other/Packaging Methods:

Cut Tape (CT)

 

Other/Manufacturing Applications:

Power Management, Consumer Electronics, Industrial, Portable Devices, Automotive

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with the REACH SVHC standard:

No SVHC

 

Compliant with standard/REACH SVHC version:

2015/12/17

 

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