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Model PMEG6010AED,115
Description 1A Up to 1.5A, NXP Semiconductors' efficient ultra small and thin surface mount packaging has been optimized for low forward voltage drop, high junction temperature, and negligible power switching loss with low leakage current in diodes and rectifiers. NXP Semiconductors NXP offers a wide range of switching diodes in different packages and configurations.
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Brand: NXP
Packaging SC-74-6
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
0.55  yuan 0.55yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(1650) Minimum order quantity(1)
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Technical parameters/forward voltage:

650mV @1A

 

Technical parameters/thermal resistance:

230℃/W (RθJA)

 

Technical parameters/forward current:

1 A

 

Technical parameters/Maximum forward surge current (Ifsm):

17.5 A

 

Technical parameters/forward voltage (Max):

650mV @1A

 

Technical parameters/forward current (Max):

1 A

 

Technical parameters/operating temperature (Max):

150 ℃

 

Technical parameters/operating temperature (Min):

-65 ℃

 

Technical parameters/operating temperature:

150℃ (Max)

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

6

 

Encapsulation parameters/Encapsulation:

SC-74-6

 

Dimensions/Length:

3.1 mm

 

Dimensions/Width:

1.7 mm

 

Dimensions/Height:

1 mm

 

Dimensions/Packaging:

SC-74-6

 

Physical parameters/operating temperature:

-65℃ ~ 150℃

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Tape & Reel (TR)

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

Compliant with standard/REACH SVHC version:

2015/12/17

 

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