Technical parameters/forward voltage: | 390mV @500mA |
|
Technical parameters/thermal resistance: | 90℃/W (RθJL) |
|
Technical parameters/forward current (Max): | 0.5 A |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Technical parameters/operating temperature: | 140℃ (Max) |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 2 |
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Encapsulation parameters/Encapsulation: | SOD-323-2 |
|
Dimensions/Packaging: | SOD-323-2 |
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Physical parameters/operating temperature: | -65℃ ~ 150℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | lead-free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PMEG2005AEA,115
|
NXP | 类似代替 | SOD-323 |
200mA 至 500mA，NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
||
PMEG2005AEA,115
|
Nexperia | 类似代替 | SOD-323 |
200mA 至 500mA，NXP Semiconductors 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流 ### 二极管和整流器，NXP Semiconductors NXP 以不同封装和配置提供广泛的开关二极管。
|
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