Chip AI consultant
Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SOIC-20 |
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Dimensions/Packaging: | SOIC-20 |
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Other (Vcc Vd): | 1.8 V ~ 3.6 V |
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Other/속도: | 32MHz |
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Other/작동온도: | -40°C ~ 85°C |
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Other/터컨버터: | A/D 9x10b |
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Other/Case/Package: | 20-SOIC (0.295", 7.50mm 폭) |
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Other/코ー크ち: | 16비트 |
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Other/RAM 크: | 1.5K x 8 |
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Other/I/O 개수: | 18 |
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Other/프로그램메모イ크ち: | 16KB (5.5K x 24) |
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Other/주변ち: | 저전압 감지/리셋, POR, PWM, WDT |
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Other/Contact information: | I²C, IrDA, SPI, UART/USART |
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Other/EEPROM 크: | 512 x 8 |
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Other/계 New: | PIC® XLP™ 24F |
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Other/프로그램메모イ형: | 플래시 |
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Other/코ー프로세ジ: | PIC |
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Other/발동ー형: | 내부 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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